Design-for-test methodology and the job of the DFT engineer have grown tremendously in the last few years. The massive amounts of internal circuitry and shear speed at which it operates have outpaced classic ATE’s ability to test it. Therefore, the tester changes residence to within the confines of the device, where it can do a better job. Luckily, the EDA industry’s adoption of smart ideas from the test R&D community (and of course their own research) has stepped up to fill the gap.
Test compression, as we’ve been discussing recently in parts 0, 1, 2, and 3 so far, is an excellent example where internal circuitry eases the requirements of the external tester. ATE tester memory requirements shot through the roof with at-speed scan requirements. A technology requiring the storage of much less test data for the same fault coverage logically follows. Actually, logic BIST falls in this category also, but that’s for another discussion. Here we explore just how much test compression buys you.
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